Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

Prijzen vanaf
139,09

Uitgelicht

VERGELIJK ALLE AANBIEDERS (2)

Beschrijving

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

Description Beschrijving
Product Specifications Productspecificaties
Gerelateerde resultaten Gerelateerde resultaten
Next
Previous

Vergelijk aanbieders (2)

Shop
Prijs
Verzendkosten
Totale prijs
Amazon Logo
139,09
Gratis
139,09
Naar shop
Gratis Shipping Costs
Amazon Marketplace Logo
139,09
Gratis
139,09
Naar shop
Gratis Shipping Costs
Beschrijving (0)

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

Productspecificaties

Merk Springer
EAN
  • 9789819641680

Independently Published

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal...

68,86
Vergelijk 2 shops 2 shops

Springer

Cu Interconnects, Glass, and AI Assisted Simulation for Chiplets Heterogeneous Integration

213,97
Meer informatie Meer info

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

120,15
Vergelijk 2 shops 2 shops

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

92,43
Vergelijk 2 shops 2 shops
Uitgelichte Keuze
139,09
Naar shop