Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration: DE

Prix à partir de
139,09

En vedette

COMPARER TOUS LES MAGASINS EN LIGNE (2)

Description

Amazon Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration: DE
Description Description
Product Specifications Spécifications du produit
Résultats connexes Résultats connexes
Next
Previous

Comparer les boutiques en ligne (2)

Shop
Prix
Affranchissement
Prix total
Amazon Logo
139,09 €
Gratuit
139,09 €
Voir l’offre
Gratuit Shipping Costs
Amazon Marketplace Logo
139,09 €
Gratuit
139,09 €
Voir l’offre
Gratuit Shipping Costs
Description (1)

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration: DE

Spécifications du produit

Marque Springer
EAN
  • 9789819641680

Independently Published

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal...

68,86 €
Comparer 2 magasins 2 magasins

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

92,43 €
Comparer 2 magasins 2 magasins

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

120,15 €
Comparer 2 magasins 2 magasins

Independently Published

ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

12,55 €
Comparer 2 magasins 2 magasins
Choix en vedette
139,09 €
Voir l’offre