Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

1/1
Afbeelding van Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems
Bol
Prijzen vanaf
63,99

Uitgelicht

VERGELIJK ALLE AANBIEDERS (3)

Beschrijving

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

Description Beschrijving
Product Specifications Productspecificaties
Price History Prijshistorie
Gerelateerde resultaten Gerelateerde resultaten
Next
Previous

Vergelijk aanbieders (3)

Sorteren op:

€ 63,99

€ 68,86

€ 68,86

Beschrijving (0)

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal Design for Multi-Die Systems

Productspecificaties

Merk Independently Published
EAN
  • 9798190431759
Maat

Prijshistorie

* Prijshistorie bevat geen data van Amazon, Amazon Marketplace.

Prijzen voor het laatst bijgewerkt op:

Springer

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

139,09
Vergelijk 2 shops 2 shops

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

165,00
Meer informatie Meer info

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets Heterogeneous Integration

185,00
Meer informatie Meer info

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

11,79
Vergelijk 2 shops 2 shops
Uitgelichte Keuze
63,99
Naar shop