ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

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ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

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Marque Independently Published
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  • 9798250306713

Independently Published

ADVANCED THERMAL MANAGEMENT TECHNOLOGIES: Heat control strategies cooling innovations and system reliability

12,06 €
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Independently Published

POWER SEMICONDUCTOR DEVICES and PACKAGING: Wide Bandgap Materials Thermal Management High Voltage Reliability

11,63 €
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ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

11,85 €
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Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness

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