Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Prix à partir de
120,15

En vedette

COMPARER TOUS LES MAGASINS EN LIGNE (2)

Description

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Description Description
Product Specifications Spécifications du produit
Résultats connexes Résultats connexes
Next
Previous

Comparer les boutiques en ligne (2)

Trier par:

120,15 €

120,15 €

Description (0)

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Spécifications du produit

Marque Independently Published
EAN
  • 9798189969195

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

11,79 €
Comparer 2 magasins 2 magasins

CRC Press

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

157,02 €
Comparer 2 magasins 2 magasins

Springer

Chiplet Design and Heterogeneous Integration Packaging

110,00 €
Comparer 2 magasins 2 magasins

Independently Published

Semiconductor Engineering Handbook: Devices, Fabrication, EUV Lithography, Advanced Packaging, Chiplets, and AI...

58,51 €
Comparer 2 magasins 2 magasins
Choix en vedette
120,15 €
Voir l’offre