Integrated Photonics: Application Specific Design and Manufacturing Photonics for Sensing Applications

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Bol Integrated Photonics for Sensing Applications introduces sensors as an important application area for integrated photonics. It provides a brief historical perspective and highlights key free-space spectroscopic sensing techniques such as FTIR, Raman, SPR, and reflectometry, and it thoroughly explores the advantages of photonic integrated circuit (PIC) sensor systems, which have the potential for low SWAP-C and high performance. The topics covered include sensor system components such as waveguides (for optical wavelengths less than and greater than 1550 nm), ring resonators and toroids, photonic crystals, MZ interferometers, light input and output, light sources (wavelengths less than and greater than 1550 nm), and spectrometers and detectors. The book considers integrated systems that employ biofunctionalization/sorbents for applications in chem–bio sensing, and it also addresses sensor manufacturing at scale, including materials, PDK development, and sensor packaging.

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Integrated Photonics for Sensing Applications introduces sensors as an important application area for integrated photonics. It provides a brief historical perspective and highlights key free-space spectroscopic sensing techniques such as FTIR, Raman, SPR, and reflectometry, and it thoroughly explores the advantages of photonic integrated circuit (PIC) sensor systems, which have the potential for low SWAP-C and high performance. The topics covered include sensor system components such as waveguides (for optical wavelengths less than and greater than 1550 nm), ring resonators and toroids, photonic crystals, MZ interferometers, light input and output, light sources (wavelengths less than and greater than 1550 nm), and spectrometers and detectors. The book considers integrated systems that employ biofunctionalization/sorbents for applications in chem–bio sensing, and it also addresses sensor manufacturing at scale, including materials, PDK development, and sensor packaging.


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