Electronic Components Failure Analysis: Methods and Experience for Beginners

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Electronic Components Failure Analysis for Beginners: Methods and ExperienceA Practical Guide to Instrument-Based Failure Diagnosis for BeginnersThis book provides practical experience in electronic factories for students majoring in electronics, beginners in electronics, and professionals in the electronics industry. It covers topics not taught in schools and introduces the causes of electronic component failure analysis.The colorful graphic analysis report allows you to absorb the author's years of experience. Beginners can learn a lifetime's worth of analysis tools in one go and quickly accumulate a year's worth of expertise.Content includes: BGA analysisDYE and PRY test2D/3D X-ray analysisSilver migration analysisEDX energy dispersive spectroscopy reportsSulfurization test, Flux, foreign matter intrusion, salination, and carbon deposit analysisSoldering ability testFTIR Fourier transform infrared spectrometer reportsXRF fluorescent X-ray hazardous substance analyzer reportsLED popcorn stress failureElectrostatic damageC-SAM ultrasonic inspectionAnd various component failure analysis reports.

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Pages: 92, Paperback, Sung Tsai Feng Isbn: 978-626-01-5418-9