Chiplet Design and Heterogeneous Integration Packaging

Name: Chiplet Design and Heterogeneous Integration Packaging
Brand: Springer
SKU: cf90a757b3a9ca666528921521003de2

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Chiplet Design and Heterogeneous Integration Packaging

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Chiplet Design and Heterogeneous Integration Packaging

Marque	Springer
EAN	9789811999161

CRC Press

Materials for Advanced Semiconductor Packaging and Heterogeneous Integration

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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

Independently Published

ADVANCED SEMICONDUCTOR PACKAGING FOR AI CHIPS: HBM Memory, Chiplet Integration, 2.5D and...

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