Chiplet Design and Heterogeneous Integration Packaging

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Description (1)

Chiplet Design and Heterogeneous Integration Packaging

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Marque Springer
EAN
  • 9789811999161

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Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

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Integration of Heterogeneous Manufacturing Machinery in Cells and Systems: Policies Practices

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Design and Applications of Heterogeneous Nanostructured Materials

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ADVANCED THERMAL MANAGEMENT FOR POWER SEMICONDUCTORS: Heat sink design packaging integration and reliability analysis

12,55 €
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