3D IC and 2.5D DESIGN: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, Design Optimization

Prix à partir de
19,16

En vedette

COMPARER TOUS LES MAGASINS EN LIGNE (2)

Description

3D IC and 2.5D DESIGN: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, Design Optimization

Description Description
Product Specifications Spécifications du produit
Résultats connexes Résultats connexes
Next
Previous

Comparer les boutiques en ligne (2)

Shop
Prix
Affranchissement
Prix total
Amazon Logo
19,16 €
Gratuit
19,16 €
Voir l’offre
Gratuit Shipping Costs
Amazon Marketplace Logo
19,16 €
Gratuit
19,16 €
Voir l’offre
Gratuit Shipping Costs
Description (0)

3D IC and 2.5D DESIGN: Architecture, Chiplets, TSVs, Interposers, Advanced Packaging, Thermal Management, Design Optimization

Spécifications du produit

Marque Independently Published
EAN
  • 9798172479724

Independently Published

SEMICONDUCTOR Packaging ENGINEERING: Advanced Chiplets 3D Integration Thermal Management Interconnects Testing and Reliability

11,79 €
Comparer 2 magasins 2 magasins

Independently Published

Chiplets and Advanced Packaging: Die-to-Die Interconnect, 2.5D 3D Integration, Hybrid Bonding, Thermal...

68,86 €
Comparer 2 magasins 2 magasins

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

92,43 €
Comparer 2 magasins 2 magasins

Independently Published

Advanced Semiconductor Packaging Handbook: Chiplets, Heterogeneous Integration, 2.5D/3D Design, Manufacturing, Reliability, and Test

120,15 €
Comparer 2 magasins 2 magasins
Choix en vedette
19,16 €
Voir l’offre